209577 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas Disposition
Sub-classes:Semiconductor device and method of manufacturing
#2MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion
#3Microelectronic device with floating pads
#4Semiconductor device and method of manufacturing
#5Microelectronic device with floating pads
#6In-cell touch display panel
#7Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
#8Semiconductor device and method of manufacturing
#9Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
#10Radiation detector element
#11Memory module in a package
#12Semiconductor memory device having pads
#13SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#14Semiconductor device
#15Semiconductor memory device having pads
#16Semiconductor memory device having pads
#17Memory module in a package
#18Memory module in a package
#19Semiconductor memory device having pads