H01L2224/0951 - CPC Classification Index

ClassID:

209583 ⎘

H01L2224/0951 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas Function

Sub-classes:

H01L2224/09515 » Bonding areas having different functions 48

Recent Application in this class:

20250357401

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

20240363545

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

20230317657

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

20180204816

Packaging through pre-formed metal pins

20180012856

Semiconductor package having a solder-on-pad structure

20160343681

Packaging through pre-formed metal pins

20160043029

Semiconductor device and method of testing semiconductor device

20150364441

Micro-pillar assisted semiconductor bonding

20150303164

Package structure with direct bond copper substrate

20150200171

Packaging through pre-formed metal pins

20150171064

PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

15141628

Integrated circuit package having two substrates

14499264

Substrate with electrically isolated bond pads