209759 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of high density interconnect preforms of a plurality of HDI interconnects
Sub-classes:MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#2MICROELECTRONIC DEVICE WITH EMBEDDED DIE SUBSTRATE ON INTERPOSER
#3SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
#4Pad Design For Reliability Enhancement in Packages
#5METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV)
#6Microelectronic device with embedded die substrate on interposer
#7Microelectronic device with embedded die substrate on interposer
#8Pad design for reliability enhancement in packages
#9Semiconductor packages having thermal through vias (TTV)
#10Package structure having redistribution layer structures
#11Microelectronic device with embedded die substrate on interposer
#12Pad design for reliability enhancement in packages
#13Semiconductor device and method for manufacturing the same
#14Pad design for reliability enhancement in packages
#15Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#16Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#17Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP
#18Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#19Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#20Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#21Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#22Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
#23Wafer level package with thermal pad for higher power dissipation
#24Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#25Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP
#26Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package
#27Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#28Semiconductor device and manufacturing method thereof
#29Semiconductor device and method of bonding different size semiconductor die at the wafer level
#30Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
#31Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#32Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#33Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#34Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
#35Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#36Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#37Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#38Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads