209781 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; High density interconnect [HDI] connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector Auxiliary members for HDI interconnects, e.g. spacers, alignment aids
Sub-classes:SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#2DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A COMPOSITE CHIPLET
#3Semiconductor package and manufacturing method thereof
#4Semiconductor structure, semiconductor package and method of fabricating the same
#5Semiconductor package and manufacturing method thereof
#6Package structure, semiconductor device and method of fabricating the same
#7Package structure and method of fabricating the same
#8Chip packaging method
#9Package structure and method of fabricating the same
#10Semiconductor package and manufacturing method thereof
#11Semiconductor package and manufacturing method thereof
#12Electrode connection structure and electrode connection method
#13Electronic component
#14Die assembly on thin dielectric sheet
#15Electronic component
#16Method of mounting devices in substrate and device-mounting substrate structure thereof