209807 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
Sub-classes:SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#2LAND-SIDE DIE COOLING OF DOUBLE-SIDED PACKAGE SUBSTRATES
#3BONDING ARRANGEMENT HAVING A METAL INVERSE OPALS LAYER
#4Display device and method of manufacturing the same
#5ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
#6UNFOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING AN UNFOLDABLE LAYERED CONNECTION
#7Cooling bond layer and power electronics assemblies incorporating the same
#8Anisotropic conductive film and production method of the same
#9Method for bonding bare chip dies
#10Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
#11Adhesive sheet and method for manufacturing semiconductor device
#12Method of mounting semiconductor element, and semiconductor device
#13Method of manufacturing semiconductor device
#14Dicing die bonding film, semiconductor wafer, and semiconductor device
#15MOLDED DIELECTRIC LAYER IN PRINT-PATTERNED ELECTRONIC CIRCUITS
#16Molded dielectric layer in print-patterned electronic circuits