Patents-Review.com
ClassID:

209817 ⎘

H01L2224/2711 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Manufacture and pre-treatment of the layer connector preform Shaping

Recent Application in this class:
#1
20250336874
2025-10-30

SINTERING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

 #2
20240371722
2024-11-07

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND METHODS OF FORMING THE SAME

 #3
20240304596
2024-09-12

SINTERING FILM FRAMES AND RELATED METHODS

 #4
20230352435
2023-11-02

SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEMICONDUCTOR MOUNTING MATERIAL FILLER, AND SEMICONDUCTOR MOUNTING MATERIAL

 #5
20230290751
2023-09-14

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME

 #6
20230191747
2023-06-22

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

 #7
20230187403
2023-06-15

METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE

 #8
20230137299
2023-05-04

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE

 #9
20230060577
2023-03-02

Connection structure and manufacturing method therefor

 #10
20220238489
2022-07-28

Semiconductor device and method of manufacturing semiconductor device

 #11
20220098462
2022-03-31

THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEET

 #12
20210398931
2021-12-23

Connection structure

 #13
20210280548
2021-09-09

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

 #14
20200365552
2020-11-19

Adhesive bonding composition and method of use

 #15
20200343211
2020-10-29

Connection structure

 #16
20200328182
2020-10-15

EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME

 #17
20200185349
2020-06-11

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

 #18
20200144214
2020-05-07

Anisotropic conductive film

 #19
20200126943
2020-04-23

Electronic assemblies having a mesh bond material and methods of forming thereof

 #20
20200098718
2020-03-26

Connection structure

 #21
20190341364
2019-11-07

Adhesive bonding composition and method of use

 #22
20190308403
2019-10-10

Anisotropic conductive film, connected structure, and method for manufacturing a connected structure

 #23
20190241771
2019-08-08

Electroconductive film, roll, connected structure, and process for producing connected structure

 #24
20190237437
2019-08-01

Nanoscale interconnect array for stacked dies

 #25
20190237424
2019-08-01

Connection structure and method for manufacturing connection structure

 #26
20190139927
2019-05-09

Anisotropic conductive film

 #27
20190096844
2019-03-28

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

 #28
20190067234
2019-02-28

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

 #29
20190055443
2019-02-21

Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device

 #30
20180308820
2018-10-25

Multi-layered composite bonding materials and power electronics assemblies incorporating the same

 #31
20180277512
2018-09-27

Embedded-bridge substrate connectors and methods of assembling same

 #32
20180218994
2018-08-02

Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

 #33
20180033762
2018-02-01

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

 #34
20170309590
2017-10-26

Anisotropic conductive film and connection structure

 #35
20170154866
2017-06-01

Adhesive bonding composition and method of use

 #36
20170047269
2017-02-16

Method for manufacturing thermal interface sheet

 #37
20170028477
2017-02-02

Method for manufacturing metal powder

 #38
20170013722
2017-01-12

Anisotropic conductive film and method for manufacturing the same

 #39
20160322327
2016-11-03

Method for manufacturing semiconductor device

 #40
20160172299
2016-06-16

Integrated device package comprising photo sensitive fill between a substrate and a die

 #41
20160126205
2016-05-05

Semiconductor device and manufacturing method for the semiconductor device

 #42
20160071814
2016-03-10

Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement

 #43
20150255418
2015-09-10

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

 #44
20150243626
2015-08-27

Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method

 #45
20150208511
2015-07-23

Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structure

 #46
20140264949
2014-09-18

Gold die bond sheet preform

 #47
20140225269
2014-08-14

Solder and die-bonding structure

 #48
20140206149
2014-07-24

Preform including a groove extending to an edge of the preform

 #49
20140193658
2014-07-10

Low void solder joint for multiple reflow applications

 #50
20130213691
2013-08-22

Electronic device

 #51
20120305632
2012-12-06

Low void solder joint for multiple reflow applications

 #52
20050212105
2005-09-29

Integrated circuit die and substrate coupling