Patents-Review.com
ClassID:

209830 ⎘

H01L2224/27418 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector in liquid form Spray coating

Recent Application in this class:
#1
20240304596
2024-09-12

SINTERING FILM FRAMES AND RELATED METHODS

 #2
20230268309
2023-08-24

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

 #3
20230191747
2023-06-22

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

 #4
20230037241
2023-02-02

TRANSPARENT DISPLAY PANEL, METHOD FOR MANUFACTURING THE SAME, AND TRANSPARENT DISPLAY DEVICE

 #5
20220399299
2022-12-15

Display device and method of manufacturing the same

 #6
20220028819
2022-01-27

Package process, DAF replacement

 #7
20210098410
2021-04-01

Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnect

 #8
20200365552
2020-11-19

Adhesive bonding composition and method of use

 #9
20200146155
2020-05-07

Multilayered transient liquid phase bonding

 #10
20190341364
2019-11-07

Adhesive bonding composition and method of use

 #11
20190198376
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #12
20190198375
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #13
20190198374
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #14
20190139928
2019-05-09

DIE BONDING RESIN LAYER FORMING APPARATUS

 #15
20180342463
2018-11-29

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

 #16
20180331065
2018-11-15

Electronic sandwich structure with two parts joined together by means of a sintering layer

 #17
20180286831
2018-10-04

Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component

 #18
20180200840
2018-07-19

Low-temperature bonding with spaced nanorods and eutectic alloys

 #19
20180197836
2018-07-12

Clip and related methods

 #20
20180190593
2018-07-05

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES

 #21
20180174881
2018-06-21

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #22
20180056455
2018-03-01

Engineered polymer-based electronic materials

 #23
20180040580
2018-02-08

POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIFFUSION BARRIER LAYER AND A SEMICONDUCTOR ELEMENT CONNECTED THERETO BY MEANS OF SINTERING, AND METHOD FOR PRODUCING SAME

 #24
20170236799
2017-08-17

Bonding method for connecting two wafers

 #25
20170154866
2017-06-01

Adhesive bonding composition and method of use

 #26
20170117247
2017-04-27

Method for bonding substrates

 #27
20170117211
2017-04-27

Clip and related methods

 #28
20170117209
2017-04-27

Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use

 #29
20160368103
2016-12-22

Alternative compositions for high temperature soldering applications

 #30
20160027694
2016-01-28

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #31
20150287699
2015-10-08

Integrated circuit package and method of making same

 #32
20150179604
2015-06-25

Method for bonding substrates

 #33
20150104902
2015-04-16

Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

 #34
20140300008
2014-10-09

Wafer scale technique for interconnecting vertically stacked dies

 #35
20140252394
2014-09-11

Light emitting device

 #36
20140242323
2014-08-28

Reactive hot-melt adhesive for use on electronics

 #37
20140225283
2014-08-14

Wafer back side coating as dicing tape adhesive

 #38
20140225274
2014-08-14

Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer

 #39
20140013595
2014-01-16

Methods for producing a bond and a semiconductor module

 #40
20130334706
2013-12-19

Integrated circuit package and method of making same

 #41
20130149841
2013-06-13

Wafer dicing employing edge region underfill removal

 #42
20130082092
2013-04-04

Curable amine, carboxylic acid flux composition and method of soldering

 #43
20130082089
2013-04-04

Curable flux composition and method of soldering

 #44
20130068373
2013-03-21

PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE

 #45
20120318431
2012-12-20

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

 #46
20120279651
2012-11-08

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

 #47
20120263946
2012-10-18

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER

 #48
20120256323
2012-10-11

Method for processing a semiconductor wafer or die, and particle deposition device

 #49
20120074561
2012-03-29

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

 #50
20120052627
2012-03-01

Method for manufacturing semiconductor devices

 #51
20110263131
2011-10-27

Method for manufacturing semiconductor device and semiconductor manufacturing apparatus

 #52
20110263078
2011-10-27

Method for manufacturing semiconductor device

 #53
20100148282
2010-06-17

WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP