209843 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector; Plating Electroplating
ELECTRONIC DEVICE AND SOLDER REFLOW-LESS PROCESS
#2BONDING ARRANGEMENT HAVING A METAL INVERSE OPALS LAYER
#3ELECTRONIC DEVICE WITH NICKEL TUNGSTEN BOTTOM PLATING
#4DIE ATTACH STRUCTURE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING A DIE ATTACH STRUCTURE, METHOD OF FORMING A SEMICONDUCTOR PACKAGE, METAL LAYER STACK AND METHOD OF FORMING A METAL LAYER STACK
#5SINTERABLE ELECTRICAL CONTACT ON A SEMICONDUCTOR SUBSTRATE
#6Advanced Device Assembly Structures And Methods
#7CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#8Structure and Method of Forming a Joint Assembly
#9INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
#10MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#11MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#12ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTURING THE SAME
#13CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
#14CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
#15Glass-based bonding structures for power electronics
#16Structure and method of forming a joint assembly
#17Seal ring structures and methods of forming same
#18Advanced device assembly structures and methods
#19Electrical connecting structure having nano-twins copper
#20Soldering a conductor to an aluminum metallization
#21Semiconductor device and method
#22DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#23Chemical mechanical polishing for hybrid bonding
#24Electrical connecting structure having nano-twins copper and method of forming the same
#25Seal ring structures and methods of forming same
#26Multi-chip package with high thermal conductivity die attach
#27Soldering a conductor to an aluminum metallization
#28Soldering a conductor to an aluminum metallization
#29Power electronic assemblies with high purity aluminum plated substrates
#30Semiconductor package structure with twinned copper
#31Electronic assemblies having a mesh bond material and methods of forming thereof
#32Integrated circuit packaging method and integrated packaging circuit
#33Structure and method of forming a joint assembly
#34Semiconductor device and method
#35Cooling bond layer and power electronics assemblies incorporating the same
#36Wafer level flat no-lead semiconductor packages and methods of manufacture
#37Wafer level flat no-lead semiconductor packages and methods of manufacture
#38Wafer level flat no-lead semiconductor packages and methods of manufacture
#39Seal ring structures and methods of forming same
#40Chemical mechanical polishing for hybrid bonding
#41Soldering a conductor to an aluminum metallization
#42Method for forming semiconductor package structure with twinned copper layer
#43METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#44Dam for three-dimensional integrated circuit
#45Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#46Flexible and compliant thermal interface materials with ultrahigh thermal conductivities
#47Seal ring structures and methods of forming same
#48Wafer level flat no-lead semiconductor packages and methods of manufacture
#49Hermetically sealed MEMS device and its fabrication
#50Structure and method of forming a joint assembly
#51METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#52Anisotropic conductive film and connection structure
#53Electronic device and method of manufacturing the electronic device
#54Semiconductor device and method for manufacturing the same
#55Semiconductor device and method for manufacturing the same
#56Non-eutectic bonding
#57High-conductivity bonding of metal nanowire arrays
#58Assembly of an integrated circuit chip and of a plate
#59POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT
#60High-conductivity bonding of metal nanowire arrays
#61Wafer stack protection seal
#62Wafer to wafer bonding process and structures
#63Electronic Assembly for Prognostics of Solder Joint
#64Semiconductor package with semiconductor die directly attached to lead frame and method
#65Process for connecting joining parts
#66Wafer level flat no-lead semiconductor packages and methods of manufacture
#67Methods and apparatus for depositing a metal layer on a semiconductor device
#68Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#69Semiconductor device
#70Dam for three-dimensional integrated circuit
#71Method for coating and bonding substrates
#72Electronic component package and method for manufacturing the same
#73SUBSTRATE OF SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
#74Electronic component
#75Coreless package structure and method for manufacturing same
#76SEMICONDUCTOR DEVICE
#77Integrated bondline spacers for wafer level packaged circuit devices
#78Wafer stack protection seal
#79Integrated bondline spacers for wafer level packaged circuit devices
#80Advanced device assembly structures and methods
#81Integrated bondline spacers for wafer level packaged circuit devices
#82Strong, heat stable junction
#83Chip package and a method for manufacturing a chip package
#84Method and apparatus for routing die signals using external interconnects
#85Method of manufacturing a component comprising cutting a carrier
#86Bonding pad for thermocompression bonding, process for producing a bonding pad and component
#87METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE
#88Package structure and substrate bonding method
#89Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#90Porous Metallic Film as Die Attach and Interconnect
#91Semiconductor device using diffusion soldering
#92Semiconductor device
#93Electronic component
#94Die backside standoff structures for semiconductor devices
#95BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#96SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE
#97Die backside standoff structures for semiconductor devices
#98Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#99SEMICONDUCTOR DEVICE
#100I/O pad structures for integrated circuit devices
#101High temperature bonding processes incorporating metal particles and bonded substrates formed therefrom
#102Quad flat non-leaded semiconductor package with wettable flank