209845 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the layer connector Conformal deposition, i.e. blanket deposition of a conformal layer on a patterned surface
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THEREOF
#2ELECTRONIC DEVICE
#3SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THEREOF
#4High-conductivity bonding of metal nanowire arrays
#5High-conductivity bonding of metal nanowire arrays