H01L2224/3001 - CPC Classification Index

ClassID:

209912 ⎘

H01L2224/3001 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors Structure

Sub-classes:

H01L2224/3003 » Layer connectors having different sizes, e.g. different heights or widths 69

Recent Application in this class:

20180374812

Method of forming solder bumps

20180204817

Package substrate and package

20180076165

Method of forming solder bumps

20180076164

Method of forming solder bumps

20180033763

Package substrate and manufacturing method thereof and package

20150108661

Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof

20150048521

Semiconductor package including stacked memory chips

20140346684

Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same

20140319656

Method and system for height registration during chip bonding