H01L2224/301 - CPC Classification Index

ClassID:

209916 ⎘

H01L2224/301 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors Disposition

Sub-classes:

H01L2224/30104 » relative to the bonding areas, e.g. bond pads, of the semiconductor or solid-state body 11
H01L2224/3012 » Layout 16
H01L2224/3018 » being disposed on at least two different sides of the body, e.g. dual array 0

Recent Application in this class:

20230223375

Package comprising spacers between integrated devices

20190221513

Semiconductor package

20160086870

Semiconductor device

20150340341

Package systems

20140170849

Package systems and manufacturing methods thereof

20120086127

Package systems having a eutectic bonding material and manufacturing methods thereof

20110294237

PACKAGING METHOD OF SEMICONDUCTOR DEVICE

20100071946

Electronic component mounting structure

20100019381

Semiconductor device and method of manufacturing a semiconductor device

20080286904

Method for manufacturing semiconductor package