209920 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors prior to the connecting process of a plurality of layer connectors Material
Sub-classes:SEMICONDUCTOR LAYOUT STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE
#2Three dimensional device integration method and integrated device
#3Three dimensional device integration method and integrated device
#4Three dimensional device integration method and integrated device
#5Three dimensional device integration method and integrated device
#6Three dimensional device integration method and integrated device
#7Three dimensional device integration method and integrated device
#8Three dimensional device integration method and integrated device