H01L2224/31 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto Structure, shape, material or disposition of the layer connectors after the connecting process

• H01L2224/32 » of an individual layer connector 40
• H01L2224/33 » of a plurality of layer connectors 82