210071 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector Coating
Sub-classes:PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
#2Package-on-package assembly with wire bond vias
#3STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
#4Package-on-package assembly with wire bond vias
#5PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#6Package-on-package assembly with wire bond vias
#7PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#8Interconnect crack arrestor structure and methods
#9Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#10Light emitting device
#11Stacked microfeature devices and associated methods
#12Packaged semiconductor assemblies and methods for manufacturing such assemblies
#13Semiconductor device
#14SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
#15Semiconductor device and manufacturing method thereof
#16Package-on-package assembly with wire bond vias
#17Semiconductor device and a method of manufacturing the same
#18Power semiconductor module
#19Interconnect crack arrestor structure and methods
#20Surface finish for wirebonding
#21Electronic device and method of fabricating an electronic device
#22LED assembly
#23Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
#24Packaged semiconductor assemblies and methods for manufacturing such assemblies
#25Semiconductor device with conductive vias
#26LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
#27Integrated circuit packaging system with array contacts and method of manufacture thereof
#28FET TRANSISTOR ON HIGH-RESISTIVITY SUBSTRATE
#29Electric device package and method of making an electric device package
#30MULTI-CORE WIRE
#31Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
#32Sensor array package
#33CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME
#34Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life
#35Interconnect crack arrestor structure and methods
#36Integrated Circuit Device With Wire Bond Connections
#37Apparatus for stud bump formation
#38Device having multiple wire bonds for a bond area and methods thereof
#39Package-on-package assembly with wire bond vias
#40Package-on-package assembly with wire bond vias
#41Package-on-package assembly with wire bond vias
#42Low loop wire bonding
#43SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
#44Method for manufacturing a package-on-package type semiconductor device
#45Semiconductor device reducing risks of a wire short-circuit and a wire flow
#46Stackable integrated circuit package system
#47Method of manufacturing semiconductor device
#48High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
#49BUMP STRUCTURE AND FABRICATION METHOD THEREOF
#50LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
#51LED PACKAGE AND METHOD FOR MANUFACTURING SAME
#52Short and low loop wire bonding
#53Optoelectronic component
#54Packaged semiconductor assemblies and methods for manufacturing such assemblies
#55Integrated circuit packaging system with step mold and method of manufacture thereof
#56Manufacturing method of semiconductor device
#57Manufacturing method of semiconductor device, and semiconductor device
#58Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
#59Stacked semiconductor component having through wire interconnect (TWI) with compressed wire
#60INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF
#61CARD INCORPORATING A TRANSPONDER
#62Semiconductor device and manufacturing method therefor
#63Semiconductor device and a method of manufacturing the same
#64Semiconductor device and method of manufacturing the semiconductor device
#65LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
#66Semiconductor device and production method therefor
#67LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#68LED PACKAGE
#69LED PACKAGE
#70Multi-chip stacking method to reduce voids between stacked chips
#71SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
#72Copper alloy bonding wire for semiconductor
#73Mixed wire semiconductor lead frame package
#74Semiconductor device comprising thin-film terminal with deformed portion
#75LED package
#76Semiconductor device
#77Method of manufacturing semiconductor device
#78Semiconductor device and method of manufacturing the same
#79ELECTRONIC DEVICE HAVING A WIRING SUBSTRATE
#80Methods of making a semiconductor device
#81Electrical microfilament to circuit interface
#82Packaged semiconductor device having improved locking properties
#83Multi-chip stack package structure
#84Multi-chip stack package structure
#85Multi-chip stack package structure
#86Semiconductor device
#87Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#88STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD
#89Method for the miniaturizable contacting of insulated wires
#90Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#91Semiconductor light emitting device packages and methods
#92Dual capillary IC wirebonding
#93Semiconductor device and a manufacturing method of the same
#94Wire bond interconnection and method of manufacture thereof
#95Semiconductor chip with post-passivation scheme formed over passivation layer
#96Die package
#97Wirebondless wafer level package with plated bumps and interconnects
#98LED package and method for manufacturing same
#99LED package
#100LED PACKAGE
#101Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same
#102Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#103Method of manufacturing semiconductor device
#104Lead, wiring member, package component, metal component with resin, resin-encapsulated semiconductor device, and methods for producing the same
#105SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#106Image sensor packaging structure with black encapsulant
#107Image sensor packaging structure with predetermined focal length
#108Method of manufacturing semiconductor device
#109Solid state emitter packages including accessory lens
#110Bonding structure of bonding wire
#111Crack resistant circuit under pad structure and method of manufacturing the same
#112Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#113Adhesive on wire stacked semiconductor package
#114Method for manufacturing a package-on-package type semiconductor device
#115Leadframe packages having enhanced ground-bond reliability
#116Packaged semiconductor assemblies and methods for manufacturing such assemblies
#117Connection for off-chip electrostatic discharge protection
#118Semiconductor device with overlapped lead terminals
#119Illumination apparatus
#120SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#121Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
#122Semiconductor device and semiconductor device manufacturing method
#123Laminated body of semiconductor chips including pads mutually connected to conductive member
#124Detecting a Fault State of a Semiconductor Arrangement
#125WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
#126Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof
#127Semiconductor device and method of manufacturing the semiconductor device
#128Power lead-on-chip ball grid array package
#129Semiconductor component having through wire interconnect (TWI) with compressed wire
#130Manufacturing method of semiconductor integrated circuit device
#131Stacked microfeature devices
#132Semiconductor device with pads overlapping wiring layers including dummy wiring
#133Method of manufacturing semiconductor device
#134ELECTROLYTIC CAPACITOR AND METHOD OF MAKING THE SAME
#135Semiconductor device and wire bonding method
#136Microelectronic assembly with impedance controlled wirebond and reference wirebond
#137Wire loop and method of forming the wire loop
#138Wire bond interconnection
#139OPTICAL TRANSMISSION MODULE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#140Ribbon bonding in an electronic package
#141Semiconductor device stack with bonding layer and wire retaining member
#142SEMICONDUCTOR DEVICE
#143CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
#144Wire bonding method
#145SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#146Solid state emitter package including red and blue emitters
#147Semiconductor chip stacked body and method of manufacturing the same
#148Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die
#149LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
#150WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SAME
#151Electrical microfilament to circuit interface
#152Semiconductor device
#153Hybrid Semiconductor Chip Package
#154Semiconductor device
#155Printed circuit board for harsh environments
#156Wire bonding structure and manufacturing method thereof
#157Resin package and production method thereof
#158Stacked integrated circuit package-in-package system and method of manufacture thereof
#159Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier
#160Method for fabricating package structure of stacked chips
#161SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#162Semiconductor device
#163Method of fabricating stacked wire bonded semiconductor package with low profile bond line
#164Method of fabricating stacked semiconductor package with localized cavities for wire bonding
#165Electronic device having a wiring substrate
#166WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#167Stacked wire bonded semiconductor package with low profile bond line
#168Stacked semiconductor package with localized cavities for wire bonding
#169Semiconductor device and manufacturing method for the same
#170SIDE VIEW LIGHT EMITTING DIODE PACKAGE
#171METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#172Semiconductor device having copper interconnect for bonding
#173Semiconductor device and manufacturing method therefor
#174Stacked structure of integrated circuits having space elements
#175LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
#176Wirebondless wafer level package with plated bumps and interconnects
#177Ball-bump bonded ribbon-wire interconnect
#178SIDE VIEW LIGHT EMITTING DIODE PACKAGE
#179Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material
#180LED illumination assembly with compliant foil construction
#181Semiconductor device
#182Semiconductor device and manufacturing method thereof
#183Semiconductor die package including embedded flip chip
#184Wire bonding method
#185Ultra-Thin Semiconductor Package
#186Module with Flat Construction and Method for Placing Components
#187Semiconductor device and method for fabricating semiconductor device
#188WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#189Adhesive on wire stacked semiconductor package
#190Semiconductor device and method of manufacturing the same
#191Dual capillary IC wirebonding
#192Semiconductor mounting bonding wire
#193Semiconductor device and method for manufacturing the same
#194Singulated semiconductor package
#195Semiconductor package and method of assembling a semiconductor package
#196Illumination system using a plurality of light sources
#197Semiconductor device and plural semiconductor elements with suppressed bending
#198Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material
#199Semiconductor element and semiconductor device
#200SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#201Thin plastic leadless package with exposed metal die paddle
#202Method for forming side wirings
#203Semiconductor apparatus having side surface wiring
#204SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF
#205WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
#206Stacked semiconductor device and semiconductor memory device
#207Packaged semiconductor assemblies and methods for manufacturing such assemblies
#208Electrically connecting substrate with electrical device
#209Mixed wire semiconductor lead frame package
#210COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
#211Integrated circuit package system with flex bump
#212Semiconductor device and wire bonding method
#213Semiconductor device and method of manufacturing the same
#214Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof
#215Integrated circuit package system with thin profile
#216Semiconductor chip with post-passivation scheme formed over passivation layer
#217Semiconductor package using copper wires and wire bonding method for the same
#218Semiconductor device
#219Semiconductor light emitting device packages and methods
#220Low shrinkage polyester thermosetting resins
#221Wire Bonds Having Pressure-Absorbing Balls
#222Semiconductor device and method of manufacturing the same
#223METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#224METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND
#225SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND
#226Integrated circuit package system with bonding in via
#227Package-type solid-state imaging apparatus with exhausting means
#228Contact carriers (tiles) for populating larger substrates with spring contacts
#229Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip
#230Semiconductor device and wire bonding method
#231Semiconductor device and method of manufacturing the same
#232Semiconductor die package including leadframe with die attach pad with folded edge
#233Stacked semiconductor device and method of manufacturing the same
#234Wiring board and semiconductor device
#235Semiconductor package and method of manufacturing the same
#236Method of bonding wire of semiconductor package
#237Direct via wire bonding and method of assembling the same
#238Stacked integrated circuit package-in-package system
#239Stackable integrated circuit package system
#240Wire bond interconnection
#241METHOD OF DIE STACKING USING INSULATED WIRE BONDS
#242Method of fabricating a film-on-wire bond semiconductor device
#243Epoxy resin composition and semiconductor package including the same
#244DIE STACKING USING INSULATED WIRE BONDS
#245FILM-ON-WIRE BOND SEMICONDUCTOR DEVICE
#246Semiconductor device and a method of manufacturing the same
#247Semiconductor device and method for manufacturing same
#248WIRE BOND AND METHOD OF FORMING SAME
#249Low loop height ball bonding method and apparatus
#250Electronic component and wire bonding method
#251Stackable micropackages and stacked modules
#252Semiconductor device and wire bonding method therefor
#253Stack type semiconductor device package
#254Semiconductor device package with groove
#255METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#256HIGH PERFORMANCE IC PACKAGE AND METHOD
#257Stacked semiconductor components with through wire interconnects (TWI)
#258Method of manufacturing semiconductor device
#259Chip-stacked package structure
#260SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#261Semiconductor device and manufacturing method for the same
#262Micro universal serial bus (USB) memory package
#263Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#264Semiconductor device and method of manufacturing the same
#265Tail wire cutting method and bonding apparatus
#266Semiconductor device and manufacturing method thereof
#267Method for making a wedge wedge wire loop
#268Stacked integrated circuit package system with connection protection
#269Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#270Illumination assembly with enhanced thermal conductivity
#271Chip Package Structure
#272Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
#273CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE
#274Stacked integrated circuit package system with face to face stack configuration
#275Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
#276LED illumination assembly with compliant foil construction
#277Semiconductor device, interposer chip and manufacturing method of semiconductor device
#278Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
#279Semiconductor device
#280Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package
#281ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME
#282Semiconductor device with semiconductor device components embedded in a plastic housing composition
#283Ribbon bonding in an electronic package
#284Electrical microfilament to circuit interface
#285Semiconductor components having through wire interconnects (TWI)
#286SEMICONDUCTOR DEVICE
#287Side view light emitting diode package
#288Led array head and image recording device
#289Chip stack package and manufacturing method thereof
#290Illumination system using a plurality of light sources
#291Single chip and stack-type chip semiconductor package and method of manufacturing the same
#292Semiconductor chip with post-passivation scheme formed over passivation layer
#293Contact carriers (tiles) for populating larger substrates with spring contacts
#294Electronic device and manufacturing method of the same
#295SEMICONDUCTOR DEVICE
#296Multi-chip package type semiconductor device
#297Computing device including a stacked semiconductor device
#298Semiconductor device and a manufacturing method of the same
#299Power plane design and jumper wire bond for voltage drop minimization
#300Method of making a stacked die package