H01L2224/481 - CPC Classification Index

ClassID:

210086 ⎘

H01L2224/481 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector Disposition

Sub-classes:

H01L2224/48101 » Connecting bonding areas at the same height, e.g. horizontal bond 149
H01L2224/48105 » Connecting bonding areas at different heights 281
H01L2224/4811 » Connecting to a bonding area of the semiconductor or solid-state body located at the far end of the body with respect to the bonding area outside the semiconductor or solid-state body 14
H01L2224/48111 » the wire connector extending above another semiconductor or solid-state body 75
H01L2224/4813 » Connecting within a semiconductor or solid-state body i.e. fly wire, bridge wire 427
H01L2224/48135 » Connecting between different semiconductor or solid-state bodies i.e. chip-to-chip 27
H01L2224/48151 » Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive 31

Recent Application in this class:

20180277640

Semiconductor device and method of manufacturing the same

20180190646

Electronic device with integrated galvanic isolation, and manufacturing method of the same

20170309572

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

20170278841

Electronic device with integrated galvanic isolation, and manufacturing method of the same

20170125311

On-bonder automatic overhang die optimization tool for wire bonding and related methods

20160035703

Die stacking techniques in BGA memory package for small footprint CPU and memory motherboard design

20160013149

Electronic device

20150235980

METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

20130134575

Packaged die for heat dissipation and method therefor

20130015578

Interconnection and assembly of three-dimensional chip packages

20120049300

SENSOR APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR SENSOR DEVICE

20110285007

Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP

20110266656

Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue