H01L2224/485 - CPC Classification Index

ClassID:

210101 ⎘

H01L2224/485 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector Material

Sub-classes:

H01L2224/48505 » at the bonding interface 23

Recent Application in this class:

20170110435

2017-04-20

Method for heating a metal member, method for bonding heated metal members, and apparatus for heating a metal member

20160307866

2016-10-20

Plastic-packaged semiconductor device having wires with polymerized insulating layer

20150076670

2015-03-19

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF