H01L2224/494 - CPC Classification Index

ClassID:

210117 ⎘

H01L2224/494 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors Connecting portions

Sub-classes:

H01L2224/4941 » the connecting portions being stacked 8
H01L2224/4943 » the connecting portions being staggered 180
H01L2224/4945 » Wire connectors having connecting portions of different types on the semiconductor or solid-state body, e.g. regular and reverse stitches 78

Recent Application in this class:

20240332243

PACKAGES WITH ELECTRICAL FUSES

20230036643

Packages with electrical fuses

20180261565

Semiconductor package structure

20180158771

Semiconductor device

20150076570

Semiconductor module and method for manufacturing the same

20140312478

Chip package and manufacturing method thereof

20110068387

Semiconductor device including vertical transistor and horizontal transistor

20100176445

Metal schemes of trench MOSFET for copper bonding

20100127323

Trench MOSFET with trench source contact having copper wire bonding

14553519

Wire bonded IC components to round wire