210123 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
SEMICONDUCTOR PACKAGE
#2DISPLAY DEVICE
#3ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#4Display device
#5Electronic component, electric device including the same, and bonding method thereof
#6ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF
#7Display device
#8Method for manufacturing mounting structure for electronic component, mounting structure for electronic component, electronic module, and wiring sheet
#9Display device
#10Electronic component, electric device including the same, and bonding method thereof
#11Display device
#12Power electronics assembly having an adhesion layer, and method for producing said assembly
#13Image pickup apparatus, endoscope, and method for manufacturing image pickup apparatus
#14Electronic component, electric device including the same, and bonding method thereof
#15Semiconductor storage devices
#16Chip-on film and display device including the same
#17Display device
#18Method for remapping a packaged extracted die
#19Radio frequency (RF) devices
#20Semiconductor module, bonding jig, and manufacturing method of semiconductor module
#21Display device
#22Conductive connecting member and display device including the same
#23Multi-die wirebond packages with elongated windows
#24Discrete flexible interconnects for modules of integrated circuits
#25Flexible circuit leads in packaging for radio frequency devices
#26Multiple die face-down stacking for two or more die
#27Electronic component, electric device including the same, and bonding method thereof
#28Multi-die wirebond packages with elongated windows
#29Lead frame strips with electrical isolation of die paddles
#30Lead frame strips with support members
#31Display panel, electronic device including the same, and bonding method thereof
#32Package for semiconductor device including guide rings and manufacturing method of the same
#33Multiple die face-down stacking for two or more die
#34Mold array process method to encapsulate substrate cut edges
#35Multiple die face-down stacking for two or more die
#36MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
#37Magnetic integration double-ended converter
#38Chip package with plank stack of semiconductor dies
#39Liquid discharge head and method for manufacturing the same
#40ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
#41Package for semiconductor device including guide rings and manufacturing method of the same
#42Radio frequency IC device and method of manufacturing the same
#43Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
#44Method for connecting a die assembly to a substrate in an integrated circuit
#45Semiconductor package including flip chip controller at bottom of die stack
#46Substrate and package with micro BGA configuration
#47Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer
#48SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS
#49RFID tag for direct and indirect food contact
#50Semiconductor device
#51ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
#52Module with stacked semiconductor devices
#53Semiconductor package including flip chip controller at bottom of die stack
#54LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES
#55Integrated circuit package system with package integration
#56Semiconductor device having a chip-size package
#57Semiconductor device having improved solder joint and internal lead lifetimes
#58Electronic device manufacturing method and supporter
#59Stacked-type semiconductor package
#60Bonding Tool
#61Singulation metal mold and method for producing semiconductor device
#62Stacked die in die BGA package
#63Stacked die with a recess in a die BGA package
#64Components, methods and assemblies for stacked packages
#65Method of fabricating a stacked die having a recess in a die BGA package
#66Semiconductor device package and method for manufacturing same
#67Die pad for semiconductor packages and methods of making and using same
#68Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
#69Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
#70Stackable single package and stacked multi-chip assembly
#71Method of fabricating a stacked die in die BGA package
#72Method of fabricating a stacked die in die BGA package
#73Stacked die in die BGA package
#74Semiconductor device and manufacturing method thereof
#75Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
#76Stacked die-in-die BGA package with die having a recess
#77Stacked-type semiconductor package
#78Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
#79Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
#80Method and structure for manufacturing improved yield semiconductor packaged devices
#81Semiconductor device having improved solder joint and internal lead lifetimes
#82Semiconductor device and manufacturing metthod thereof
#83Semiconductor device and manufacturing method thereof
#84Simplified stacked chip assemblies
#85Stacked chip assembly with encapsulant layer
#86Semiconductor module in which a semiconductor package is bonded on a mount substrate
#87Electromagnetic wall in millimeter-wave cavity