Patents-Review.com
ClassID:

210212 ⎘

H01L2224/75253 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means adapted for localised heating

Recent Application in this class:
#1
20260005190
2026-01-01

Semiconductor Device and Method of Forming Interconnect Structure Using VFM and TCB

 #2
20250183223
2025-06-05

IC CHIP MOUNTING APPARATUS AND IC CHIP MOUNTING METHOD

 #3
20250176105
2025-05-29

SELECTIVE TRANSFER OF MICRO DEVICES

 #4
20250105203
2025-03-27

SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING SOLDERING APPARATUS

 #5
20250015030
2025-01-09

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

 #6
20240395767
2024-11-28

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS OF PROCESSING SEMICONDUCTOR DEVICES

 #7
20240381531
2024-11-14

SELECTIVE TRANSFER OF MICRO DEVICES

 #8
20230352441
2023-11-02

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

 #9
20230317676
2023-10-05

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

 #10
20230019546
2023-01-19

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

 #11
20220384383
2022-12-01

Heat assisted flip chip bonding apparatus

 #12
20220352412
2022-11-03

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

 #13
20220302079
2022-09-22

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

 #14
20220254745
2022-08-11

Selective micro device transfer to receiver substrate

 #15
20220139857
2022-05-05

Selective micro device transfer to receiver substrate

 #16
20220139856
2022-05-05

Selective micro device transfer to receiver substrate

 #17
20220130783
2022-04-28

Selective micro device transfer to receiver substrate

 #18
20210327740
2021-10-21

Selective micro device transfer to receiver substrate

 #19
20210327739
2021-10-21

Selective micro device transfer to receiver substrate

 #20
20210257329
2021-08-19

Semiconductor chip mounting device and method for manufacturing semiconductor device

 #21
20210243894
2021-08-05

Selective transfer of micro devices

 #22
20210202431
2021-07-01

Laser reflow apparatus and laser reflow method

 #23
20200350281
2020-11-05

Selective micro device transfer to receiver substrate

 #24
20200212001
2020-07-02

Methods and systems for manufacturing semiconductor devices

 #25
20200006283
2020-01-02

Methods for improved die bonding

 #26
20190189586
2019-06-20

Component joining apparatus, component joining method and mounted structure

 #27
20180358325
2018-12-13

System for processing semiconductor devices

 #28
20180130683
2018-05-10

Apparatus and method for contactless transfer and soldering of chips using a flash lamp

 #29
20180019191
2018-01-18

Conductive connections, structures with such connections, and methods of manufacture

 #30
20170194284
2017-07-06

Method and device for improved die bonding

 #31
20170179067
2017-06-22

Semiconductor package alignment frame for local reflow

 #32
20170125374
2017-05-04

Rework process and tool design for semiconductor package

 #33
20170062373
2017-03-02

Electronic apparatus and method for fabricating the same

 #34
20170012013
2017-01-12

Electronic apparatus and method for fabricating the same

 #35
20160351526
2016-12-01

INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE

 #36
20160336286
2016-11-17

Conductive connections, structures with such connections, and methods of manufacture

 #37
20160247776
2016-08-25

Electronic apparatus and method for fabricating the same

 #38
20160225736
2016-08-04

Fog bonding device and method thereof

 #39
20160143154
2016-05-19

Component mounting apparatus

 #40
20150325543
2015-11-12

Conductive connections, structures with such connections, and methods of manufacture

 #41
20150325507
2015-11-12

Conductive connections, structures with such connections, and methods of manufacture

 #42
20150270438
2015-09-24

Method for manufacturing liquid crystal display device

 #43
20150202851
2015-07-23

Substrate composite, method and device for bonding of substrates

 #44
20150171051
2015-06-18

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

 #45
20150162312
2015-06-11

Electronic apparatus and method for fabricating the same

 #46
20150155254
2015-06-04

Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements

 #47
20150129135
2015-05-14

Bonding head and die bonding apparatus having the same

 #48
20150107765
2015-04-23

UV-curable anisotropic conductive adhesive

 #49
20150060527
2015-03-05

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING

 #50
20150050778
2015-02-19

METHOD AND APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE

 #51
20130026212
2013-01-31

SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS

 #52
20120319253
2012-12-20

Method of Manufacturing a semiconductor module and device for the same

 #53
20120222808
2012-09-06

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

 #54
20110244632
2011-10-06

Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime

 #55
20100024667
2010-02-04

PRESSURE-HEATING APPARATUS AND METHOD

 #56
20090236721
2009-09-24

Semiconductor device including a pressure-contact section

 #57
20090120916
2009-05-14

Through-Via Laser Reflow Systems And Methods For Surface Mount Components

 #58
20090032296
2009-02-05

Method of manufacturing a contact arrangement between a microelectronic component and a carrier