Patents-Review.com
ClassID:

210214 ⎘

H01L2224/75261 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means Laser

Sub-classes:
Recent Application in this class:
#1
20240047280
2024-02-08

MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING APPARATUS FOR A MICRO ELEMENT

 #2
20240033840
2024-02-01

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

 #3
20230068569
2023-03-02

Method for soldering electronic component and method for manufacturing LED display

 #4
20220415698
2022-12-29

APPARATUS AND METHOD FOR TRANSFERRING LIGHT-EMITTING DIODES

 #5
20220367404
2022-11-17

Bonding head with large and small spray apertures

 #6
20220352412
2022-11-03

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

 #7
20220157769
2022-05-19

Device and method for reel-to-reel laser reflow

 #8
20210159208
2021-05-27

Chip bonding method and bonding device

 #9
20200335344
2020-10-22

Laser bonding apparatus for three-dimensional molded sculptures

 #10
20200321310
2020-10-08

Device and method for reel-to-reel laser reflow

 #11
20200251453
2020-08-06

Direct transfer of semiconductor devices from a substrate

 #12
20200243491
2020-07-30

Apparatus for direct transfer of semiconductor device die

 #13
20200235081
2020-07-23

Method for transfer of semiconductor devices onto glass substrates

 #14
20200168587
2020-05-28

Systems for direct transfer of semiconductor device die

 #15
20200051948
2020-02-13

High speed handling of ultra-small chips by selective laser bonding and debonding

 #16
20200027764
2020-01-23

Device and method for contactlessly transferring at least partly ferromagnetic electronic components from a carrier to a substrate

 #17
20190348405
2019-11-14

Apparatus for direct transfer of semiconductor device die

 #18
20190348392
2019-11-14

High speed handling of ultra-small chips by selective laser bonding and debonding

 #19
20190237445
2019-08-01

Method for improved transfer of semiconductor die

 #20
20190139945
2019-05-09

METHOD AND APPARATUS FOR LIGHT DIFFUSION

 #21
20190057891
2019-02-21

Placing ultra-small or ultra-thin discrete components

 #22
20180366435
2018-12-20

Apparatus for laser bonding of flip chip and method for laser bonding of flip chip

 #23
20180366433
2018-12-20

Apparatus for bonding semiconductor chip and method for bonding semiconductor chip

 #24
20180286838
2018-10-04

Apparatus for direct transfer of semiconductor device die

 #25
20180261580
2018-09-13

Apparatus for direct transfer of semiconductor devices with needle retraction support

 #26
20180261579
2018-09-13

Method and apparatus for improved direct transfer of semiconductor die

 #27
20180233495
2018-08-16

Substrate with array of LEDs for backlighting a display device

 #28
20180065186
2018-03-08

Micro-selective sintering laser systems and methods thereof

 #29
20180053752
2018-02-22

Apparatus for multi-direct transfer of semiconductors

 #30
20170365586
2017-12-21

Semiconductor device on string circuit and method of making the same

 #31
20170256524
2017-09-07

Semiconductor device on glass substrate

 #32
20170256523
2017-09-07

Method and apparatus for transfer of semiconductor devices

 #33
20170140967
2017-05-18

Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other

 #34
20170140959
2017-05-18

Apparatus and method for direct transfer of semiconductor devices

 #35
20160288259
2016-10-06

Laser welding method

 #36
20150179539
2015-06-25

Laser welding method, laser welding jig, and semiconductor device

 #37
20150171048
2015-06-18

Bonding device

 #38
20130210194
2013-08-15

Method of transferring and bonding an array of micro devices

 #39
20120319253
2012-12-20

Method of Manufacturing a semiconductor module and device for the same