H01L2224/75264 - CPC Classification Index

ClassID:

210217 ⎘

H01L2224/75264 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means by induction heating, i.e. coils

Sub-classes:

H01L2224/75265 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 14
H01L2224/75266 » in the upper part of the bonding apparatus, e.g. in the bonding head 22

Recent Application in this class:

20250329687

BONDING APPARATUS AND OPERATING METHOD THEREOF

20250174596

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE USED THEREFOR

20200251441

Semiconductor chip mounting apparatus and semiconductor chip mounting method

20160379951

Magnetic intermetallic compound interconnect

20160155720

Method and apparatus for chip-to-wafer integration

20150060527

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL COMPRESSION BONDING

20140353540

Anisotropic conductive adhesive with reduced migration

20130320529

Reactive bonding of a flip chip package

20130224444

Magnetic attachment structure

20130170171

Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices

20120319253

Method of Manufacturing a semiconductor module and device for the same

20110278044

Magnetic attachment structure

20070023486

Apparatus and a method of soldering a part to a board