H01L2224/7528 - CPC Classification Index

ClassID:

210226 ⎘

H01L2224/7528 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means Resistance welding electrodes, i.e. for ohmic heating

Sub-classes:

H01L2224/75281 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 8
H01L2224/75282 » in the upper part of the bonding apparatus, e.g. in the bonding head 11

Recent Application in this class:

20130170171

2013-07-04

Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices