H01L2224/75313 - CPC Classification Index

ClassID:

210234 ⎘

H01L2224/75313 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for applying energy, e.g. heating means by means of pressure; Bonding head Removable bonding head

Recent Application in this class:

20230095879

2023-03-30

METHOD FOR USING A BUFFER SHEET

20160190087

2016-06-30

Chip-stacking apparatus having a transport device configured to transport a chip onto a substrate

20120247664

2012-10-04

Bonding apparatus and bonding method

20110175237

2011-07-21

Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

20080211143

2008-09-04

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

20080211086

2008-09-04

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate