H01L2224/75655 - CPC Classification Index

ClassID:

210254 ⎘

H01L2224/75655 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for transporting the components to be connected in a fluid

Recent Application in this class:

20240258270

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USING THE SAME

20230386878

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICATING DISPLAY DEVICE

20220165702

Device and method of fluidic assembly of microchips on a substrate

20220005719

Apparatus for and method for aligning dipoles and method of fabricating display device

20210366744

PICK AND PLACEMENT OF SEMICONDUCTOR CHIPS BASED ON NOZZLELESS SELF-FOCUSING ACOUSTIC DROPLET EJECTOR

20200279826

Assembly apparatus for assembling semiconductor light emitting diode to display panel

20180102352

Fluid-suspended microcomponent harvest, distribution, and reclamation

20180076168

Fluidic Self Assembly of Contact Materials

20170278835

LED chip mounting apparatus and method of manufacturing display apparatus by using the LED chip mounting apparatus

20160111408

Light emitting diodes and a method of packaging the same

20150050761

Light emitting diodes and a method of packaging the same

20130168708

Method for disposing fine objects, apparatus for arranging fine objects, illuminating apparatus and display apparatus