H01L2224/758 - CPC Classification Index

ClassID:

210274 ⎘

H01L2224/758 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors Means for moving parts

Sub-classes:

H01L2224/75801 » Lower part of the bonding apparatus, e.g. XY table 13
H01L2224/75821 » Upper part of the bonding apparatus, i.e. bonding head 16
H01L2224/75841 » of the bonding head 18

Recent Application in this class:

20190333798

Alignment mechanism, chuck device, and bonder

20150069115

Device and method for bonding substrates

20130062782

Stacked semiconductor devices and fabrication method/equipment for the same

20120329182

SEMICONDUCTOR DEVICE MOUNTING METHOD

20110198388

Flux-free chip to wafer joint serial thermal processor arrangement

20110088257

Mounting apparatus

20070175021

Method for mounting electronic components on a support

20070145102

Method for mounting a flip chip on a substrate

20070137559

Paste coater and PoP automatic mounting apparatus employing the same

20070006454

Component mounting method

20070006453

Component mounting apparatus and component mounting method

20060164818

Electronic assembly having a substrate laminated within a backplate cavity

20060091555

Method of mounting an electronic part to a substrate

20050284921

Method of soldering electronic component having solder bumps to substrate

20050098610

Apparatus and method for mounting electronic components