H01L2224/75982 - CPC Classification Index

ClassID:

210293 ⎘

H01L2224/75982 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Apparatus chuck Shape

Sub-classes:

H01L2224/75983 » of the mounting surface 25
H01L2224/75984 » of other portions 16

Recent Application in this class:

20180370210

2018-12-27

Wafer bonding apparatus and wafer bonding system including the same