H01L2224/75986 - CPC Classification Index

ClassID:

210297 ⎘

H01L2224/75986 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Apparatus chuck Auxiliary members on the pressing surface

Sub-classes:

H01L2224/75987 » Shape of the auxiliary member 7
H01L2224/75988 » Material of the auxiliary member 10

Recent Application in this class:

20230061379

Low warpage curing methodology by inducing curvature

20220020710

SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE

20200343216

Bonding apparatus, bonding system, bonding method and storage medium

20200251443

Warpage-compensated bonded structure including a support chip and a three-dimensional memory chip

20190385973

Bonding apparatus, bonding system, bonding method and storage medium

20180158796

Bonding apparatus, bonding system, bonding method and storage medium

20100085723

Mounting method using dilatancy fluid

20080156434

DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING METHOD

20070144668

DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRICAL APPARATUS