ClassID:

210540

H01L2224/7801 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma

Recent Application in this class:
#1
20250100025
2025-03-27

ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL

#2
20250091096
2025-03-20

CLEANING APPARATUS FOR A WIRE CLAMP CONFIGURED TO CLAMP A WIRE USED IN A WIRE BONDING PROCESS AND CLEANING SYSTEM INCLUDING THE CLEANING APPARATUS

#3
20210162470
2021-06-03

SELF-CLEANING WIRE BONDING MACHINE

#4
20200388590
2020-12-10

Method of vertically vibrating a bonding arm

#5
20190372294
2019-12-05

APPARATUS AND METHOD FOR WIRE PREPARATION

#6
20190237427
2019-08-01

CLEANING SYSTEMS FOR WIRE BONDING TOOLS, WIRE BONDING MACHINES INCLUDING SUCH SYSTEMS, AND RELATED METHODS

#7
20180308821
2018-10-25

Semiconductor wire bonding machine cleaning device and method

#8
20180151532
2018-05-31

WIRE BONDING APPARATUS

#9
20160351536
2016-12-01

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

#10
20150072473
2015-03-12

Die attachment apparatus and method utilizing activated forming gas

#11
20140332583
2014-11-13

WIRE BONDING APPARATUS

#12
20130341377
2013-12-26

Wedge bonder and a method of cleaning a wedge bonder

#13
20110290860
2011-12-01

Wire bonding apparatus and method thereof

#14
20100294435
2010-11-25

Bonding apparatus and wire bonding method

#15
20090039141
2009-02-12

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

#16
20080305579
2008-12-11

Method for fabricating semiconductor device installed with passive components

#17
20080197168
2008-08-21

Wire cleaning guide

#18
20080023028
2008-01-31

Bonding apparatus and method for cleaning tip of a bonding tool

#19
20070071900
2007-03-29

Methods for protecting metal surfaces

#20
20070000878
2007-01-04

Bonding apparatus and method

#21
20060289605
2006-12-28

Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip

#22
20060219754
2006-10-05

Bonding wire cleaning unit and method of wire bonding using same

#23
20050184133
2005-08-25

Laser cleaning system for a wire bonding machine

#24
15495873
2017-11-21

Semiconductor wire bonding machine cleaning device and method