H01L2224/7815 - CPC Classification Index

ClassID:

210545 ⎘

H01L2224/7815 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Means for applying permanent coating, e.g. in-situ coating

Recent Application in this class:

20240429196

2024-12-26

SELECTIVE WIRE COATING DURING WIRE BONDING

20180138143

2018-05-17

Wire bonding methods and systems incorporating metal nanoparticles

20180082977

2018-03-22

Method of manufacturing semiconductor device

20170053895

2017-02-23

Wire bonding methods and systems incorporating metal nanoparticles