H01L2224/78267 - CPC Classification Index

ClassID:

210558 ⎘

H01L2224/78267 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for applying energy, e.g. heating means Flame torch, e.g. hydrogen torch

Recent Application in this class:

20210057374

2021-02-25

Full-automatic deep access ball bonding head device

20120067940

2012-03-22

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

20120043655

2012-02-23

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

20100102444

2010-04-29

Wafer level package using stud bump coated with solder