Patents-Review.com
ClassID:

210569 ⎘

H01L2224/78301 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for applying energy, e.g. heating means by means of pressure Capillary

Sub-classes:
Recent Application in this class:
#1
20250226353
2025-07-10

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND METHODS FOR FABRICATING THE SAME

 #2
20250149502
2025-05-08

CAPILLARY FOR A WIRE BONDING MACHINE HAVING A DYNAMICALLY ADJUSTABLE CHAMFER DIAMETER

 #3
20250118705
2025-04-10

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

 #4
20250062199
2025-02-20

SEMICONDUCTOR DEVICE

 #5
20240290746
2024-08-29

BALL BONDING FOR SEMICONDUCTOR DEVICES

 #6
20240055393
2024-02-15

Package-on-package assembly with wire bond vias

 #7
20230343742
2023-10-26

Ultrasonic horn and manufacturing apparatus of semiconductor device

 #8
20230298981
2023-09-21

Semiconductor device

 #9
20230282613
2023-09-07

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPARATUS

 #10
20220320040
2022-10-06

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETERMINATION DEVICE

 #11
20220199567
2022-06-23

Semiconductor package

 #12
20220165703
2022-05-26

Package-on-package assembly with wire bond vias

 #13
20220134468
2022-05-05

Capillary guide device and wire bonding apparatus

 #14
20220028763
2022-01-27

Semiconductor device

 #15
20210366869
2021-11-25

Wire bonding method and wire bonding device

 #16
20210358881
2021-11-18

Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus

 #17
20210358873
2021-11-18

Wire bonding method for semiconductor package

 #18
20210257330
2021-08-19

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

 #19
20210035948
2021-02-04

Package-on-package assembly with wire bond vias

 #20
20200411465
2020-12-31

Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same

 #21
20200388590
2020-12-10

Method of vertically vibrating a bonding arm

 #22
20200286855
2020-09-10

Formation of bonding wire vertical interconnects

 #23
20200091107
2020-03-19

Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement method

 #24
20200066619
2020-02-27

Plurality of lead frames electrically connected to inductor chip

 #25
20190378814
2019-12-12

Ball bond attachment for a semiconductor die

 #26
20190378787
2019-12-12

Semiconductor device

 #27
20190319005
2019-10-17

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

 #28
20190287941
2019-09-19

Wire bonding method and wire bonding apparatus

 #29
20190279957
2019-09-12

Wire clamp apparatus calibration method and wire bonding apparatus

 #30
20190279915
2019-09-12

Electronic device

 #31
20190237428
2019-08-01

Method for calibrating wire clamp device

 #32
20190181072
2019-06-13

Compact wirebonding in stacked-chip system in package, and methods of making same

 #33
20190157197
2019-05-23

Semiconductor device package

 #34
20190051590
2019-02-14

Semiconductor package device and method of manufacturing the same

 #35
20190039553
2019-02-07

Curtain airbag device mounting structure and curtain airbag deployment method

 #36
20190035705
2019-01-31

Semiconductor package with supported stacked die

 #37
20190027463
2019-01-24

On-bonder automatic overhang die optimization tool for wire bonding and related methods

 #38
20180366397
2018-12-20

Semiconductor device

 #39
20180342442
2018-11-29

Semiconductor device and method for manufacturing the same

 #40
20180331064
2018-11-15

Electrical interconnections for semiconductor devices and methods for forming the same

 #41
20180331025
2018-11-15

Semiconductor device with first and second semiconductor chips connected to insulating element

 #42
20180323166
2018-11-08

Manufacturing method of semiconductor device

 #43
20180315732
2018-11-01

Capillary transport device, capillary mounting device, capillary replacement device, capillary transport method, capillary mounting method, and capillary replacement method

 #44
20180308821
2018-10-25

Semiconductor wire bonding machine cleaning device and method

 #45
20180301420
2018-10-18

Semiconductor device and manufacturing method thereof

 #46
20180294243
2018-10-11

Semiconductor device and ball bonder

 #47
20180269179
2018-09-20

Semiconductor device and method for manufacturing the same

 #48
20180261568
2018-09-13

Window Clamp

 #49
20180261567
2018-09-13

Window Clamp

 #50
20180240774
2018-08-23

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

 #51
20180240771
2018-08-23

Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same

 #52
20180174996
2018-06-21

Wire bonded wide I/O semiconductor device

 #53
20180151544
2018-05-31

LED module

 #54
20180151532
2018-05-31

WIRE BONDING APPARATUS

 #55
20180138143
2018-05-17

Wire bonding methods and systems incorporating metal nanoparticles

 #56
20180108629
2018-04-19

Semiconductor device and method of manufacturing the same

 #57
20180096965
2018-04-05

Method for forming ball in bonding wire

 #58
20180096908
2018-04-05

Semiconductor device

 #59
20180090420
2018-03-29

Method of manufacturing semiconductor device and semiconductor device

 #60
20180068972
2018-03-08

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

 #61
20180061803
2018-03-01

Bonding device

 #62
20180047659
2018-02-15

Support terminal integral with die pad in semiconductor package

 #63
20180026007
2018-01-25

Package-on-package assembly with wire bond vias

 #64
20180026004
2018-01-25

Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire

 #65
20180005981
2018-01-04

Semiconductor device

 #66
20170365576
2017-12-21

Bonding wire for semiconductor device

 #67
20170345787
2017-11-30

Methods of forming wire interconnect structures

 #68
20170330854
2017-11-16

Ball forming device for wire bonder

 #69
20170323848
2017-11-09

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

 #70
20170309547
2017-10-26

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

 #71
20170287868
2017-10-05

Method of manufacturing semiconductor device

 #72
20170271225
2017-09-21

Electronic device

 #73
20170229419
2017-08-10

Capillary jig for wire bonding and method of installing a capillary

 #74
20170229382
2017-08-10

Semiconductor device

 #75
20170200690
2017-07-13

Bonding wire for semiconductor device

 #76
20170179075
2017-06-22

Copper wire and electrode joining method and joint structure

 #77
20170162539
2017-06-08

Method of manufacturing semiconductor device

 #78
20170154864
2017-06-01

Bonding apparatus and method of estimating position of landing point of bonding tool

 #79
20170150601
2017-05-25

Package, electronic component, and electronic apparatus

 #80
20170084569
2017-03-23

Semiconductor device and production method therefor

 #81
20170053893
2017-02-23

Semiconductor device having wire formed with loop portion and method for producing the semiconductor device

 #82
20170040280
2017-02-09

Methods of forming wire interconnect structures

 #83
20170011978
2017-01-12

Semiconductor device

 #84
20170005065
2017-01-05

Bonding device

 #85
20170005064
2017-01-05

Bonding device

 #86
20170005048
2017-01-05

Semiconductor integrated circuit device

 #87
20160365331
2016-12-15

Wire tensioner

 #88
20160365330
2016-12-15

Method for producing semiconductor device, and wire-bonding apparatus

 #89
20160365299
2016-12-15

Semiconductor device

 #90
20160358880
2016-12-08

Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus

 #91
20160358879
2016-12-08

Discharge examination device, wire-bonding apparatus, and discharge examination method

 #92
20160351538
2016-12-01

Ball forming device, wire-bonding apparatus, and ball formation method

 #93
20160351537
2016-12-01

Wire bonding apparatus and method of manufacturing semiconductor device

 #94
20160351535
2016-12-01

Method of manufacturing semiconductor device and wire bonding apparatus

 #95
20160307854
2016-10-20

Support terminal integral with die pad in semiconductor package

 #96
20160300989
2016-10-13

Light emitting device

 #97
20160300776
2016-10-13

Semiconductor device

 #98
20160276305
2016-09-22

Window clamp

 #99
20160268222
2016-09-15

Semiconductor device and method of manufacturing the same

 #100
20160260647
2016-09-08

Method for package-on-package assembly with wire bonds to encapsulation surface

 #101
20160254214
2016-09-01

Method of manufacturing semiconductor device and semiconductor device

 #102
20160225739
2016-08-04

Off substrate kinking of bond wire

 #103
20160181186
2016-06-23

Semiconductor device and production method therefor

 #104
20160163625
2016-06-09

Semiconductor device

 #105
20160133548
2016-05-12

Method for manufacturing semiconductor device, and semiconductor device

 #106
20160104664
2016-04-14

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

 #107
20160086877
2016-03-24

Semiconductor device

 #108
20160056124
2016-02-25

Method of manufacturing semiconductor device

 #109
20160035695
2016-02-04

Method of manufacturing semiconductor device

 #110
20160023298
2016-01-28

Wire bonding apparatus comprising an oscillator mechanism

 #111
20160020162
2016-01-21

Semiconductor device

 #112
20160013149
2016-01-14

Electronic device

 #113
20160013143
2016-01-14

Electronic device

 #114
20150380375
2015-12-31

Method of forming a component having wire bonds and a stiffening layer

 #115
20150371967
2015-12-24

Method of manufacturing semiconductor device

 #116
20150364740
2015-12-17

High-voltage energy storage module and method for producing the high-voltage energy storage module

 #117
20150340398
2015-11-26

Electronic component device

 #118
20150340350
2015-11-26

Semiconductor device

 #119
20150294926
2015-10-15

Module comprising a semiconductor chip

 #120
20150262963
2015-09-17

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

 #121
20150255425
2015-09-10

Semiconductor device packaging having plurality of wires bonding to a leadframe

 #122
20150255424
2015-09-10

Package-on-package assembly with wire bond vias

 #123
20150249063
2015-09-03

Wire-bonding apparatus and method of manufacturing semiconductor device

 #124
20150246411
2015-09-03

Wire-bonding apparatus and method of wire bonding

 #125
20150243627
2015-08-27

Wire-bonding apparatus and method of manufacturing semiconductor device

 #126
20150228621
2015-08-13

Semiconductor device including alternating stepped semiconductor die stacks

 #127
20150228618
2015-08-13

Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device

 #128
20150214180
2015-07-30

Antioxidant gas blow-off unit

 #129
20150209886
2015-07-30

Antioxidant gas blow-off unit

 #130
20150200181
2015-07-16

Semiconductor device

 #131
20150194396
2015-07-09

Bond pad having a trench and method for forming

 #132
20150194368
2015-07-09

Method for manufacturing semiconductor device, and semiconductor device

 #133
20150189703
2015-07-02

Light emitting device exhibiting excellent heat resistance and good color reproducibility through fluorescent material arrangement

 #134
20150132888
2015-05-14

Methods of forming wire interconnect structures

 #135
20150125996
2015-05-07

Semiconductor packages and methods of manufacturing the same

 #136
20150111376
2015-04-23

Processes and structures for IC fabrication

 #137
20150108624
2015-04-23

Semiconductor device

 #138
20150102091
2015-04-16

Methods for forming apparatus for stud bump formation

 #139
20150090480
2015-04-02

Electronic component package and method for forming same

 #140
20150061157
2015-03-05

High yield semiconductor device

 #141
20150044823
2015-02-12

Method of forming a wire bond having a free end

 #142
20150035172
2015-02-05

Semiconductor device and method of manufacturing the same

 #143
20150031149
2015-01-29

Multi-chip package and method of manufacturing the same

 #144
20150008251
2015-01-08

Method and apparatus for measuring a free air ball size during wire bonding

 #145
20150001739
2015-01-01

Wire tail connector for a semiconductor device

 #146
20140374890
2014-12-25

Semiconductor device and method for manufacturing the same

 #147
20140363926
2014-12-11

Semiconductor device and method for manufacturing the same

 #148
20140361444
2014-12-11

Semiconductor device with overlapped lead terminals

 #149
20140353822
2014-12-04

Semiconductor device

 #150
20140339691
2014-11-20

Semiconductor device having a plurality of circuits arranged on a side of a semiconductor chip

 #151
20140332942
2014-11-13

Method of manufacturing semiconductor device and semiconductor device

 #152
20140319702
2014-10-30

Stackable package by using internal stacking modules

 #153
20140311590
2014-10-23

Antioxidant gas supply unit

 #154
20140306328
2014-10-16

Semiconductor device

 #155
20140305996
2014-10-16

Bonding apparatus

 #156
20140299979
2014-10-09

Semiconductor device and a method for manufacturing a semiconductor device

 #157
20140291706
2014-10-02

Light emitting diode device

 #158
20140284790
2014-09-25

Semiconductor device and method of manufacturing the same

 #159
20140284784
2014-09-25

Semiconductor device

 #160
20140225259
2014-08-14

Semiconductor module system having encapsulated through wire interconnect (TWI)

 #161
20140217619
2014-08-07

Microelectronic package having wire bond vias and stiffening layer

 #162
20140209663
2014-07-31

Wire bonder and method of calibrating a wire bonder

 #163
20140196278
2014-07-17

Sonotrode with cutting mechanism

 #164
20140191775
2014-07-10

Coaxial probe structure of elongated electrical conductors projecting from a support structure

 #165
20140183727
2014-07-03

Waterfall wire bonding

 #166
20140138426
2014-05-22

Wire bonding apparatus and bonding method

 #167
20140120664
2014-05-01

Lead frame with grooved lead finger

 #168
20140073068
2014-03-13

Method of manufacturing semiconductor device

 #169
20140059841
2014-03-06

Transferring an antenna to an RFID inlay substrate

 #170
20140054739
2014-02-27

Semiconductor device and electronic device

 #171
20140042621
2014-02-13

Package on package devices and methods of forming same

 #172
20140041918
2014-02-13

Looped interconnect structure

 #173
20140004660
2014-01-02

System and method for forming uniform rigid interconnect structures

 #174
20140001620
2014-01-02

Method for manufacturing semiconductor device, and semiconductor device

 #175
20130341378
2013-12-26

SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL

 #176
20130334687
2013-12-19

Semiconductor device packaging having plurality of wires bonding to a leadframe

 #177
20130328219
2013-12-12

Package-on-package assembly with wire bond vias

 #178
20130328194
2013-12-12

Short and low loop wire bonding

 #179
20130327812
2013-12-12

Bond pad assessment for wire bonding

 #180
20130307148
2013-11-21

Low loop wire bonding

 #181
20130306352
2013-11-21

Bonding wire for semiconductor

 #182
20130299983
2013-11-14

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

 #183
20130299589
2013-11-14

Laser-ablating mechanical and security features for security documents

 #184
20130292856
2013-11-07

Method for the wafer-level integration of shape memory alloy wires

 #185
20130286592
2013-10-31

Electronic component and electronic apparatus

 #186
20130277835
2013-10-24

Semiconductor device

 #187
20130277414
2013-10-24

Methods of adjusting ultrasonic bonding energy on wire bonding machines

 #188
20130270701
2013-10-17

SYSTEM AND METHODS FOR WIRE BONDING

 #189
20130264693
2013-10-10

Lead frame with grooved lead finger

 #190
20130240605
2013-09-19

Wire bonder including a transducer, a bond head, and a mounting apparatus

 #191
20130224914
2013-08-29

Method for package-on-package assembly with wire bonds to encapsulation surface

 #192
20130200533
2013-08-08

Package-on-package assembly with wire bond vias

 #193
20130200514
2013-08-08

Semiconductor packages and methods of manufacturing the same

 #194
20130196452
2013-08-01

Wire bonding method in circuit device

 #195
20130193561
2013-08-01

Processes and structures for IC fabrication

 #196
20130193455
2013-08-01

Light emitter packages and devices having improved wire bonding and related methods

 #197
20130180957
2013-07-18

Method of recovering a bonding apparatus from a bonding failure

 #198
20130175677
2013-07-11

Integrated Circuit Device With Wire Bond Connections

 #199
20130171776
2013-07-04

Semiconductor device and method for manufacturing the same

 #200
20130152366
2013-06-20

Method for manufacturing an optical unit

 #201
20130125390
2013-05-23

Wire loops, methods of forming wire loops, and related processes

 #202
20130119526
2013-05-16

Lead frame, semiconductor manufacturing apparatus, and semiconductor device

 #203
20130119114
2013-05-16

Method and apparatus for monitoring free air ball (FAB) formation in wire bonding

 #204
20130105979
2013-05-02

Package on package devices and methods of packaging semiconductor dies

 #205
20130098877
2013-04-25

Automatic wire tail adjustment system for wire bonders

 #206
20130095610
2013-04-18

Package-on-package assembly with wire bond vias

 #207
20130093088
2013-04-18

Package-on-package assembly with wire bond vias

 #208
20130093087
2013-04-18

Package-on-package assembly with wire bond vias

 #209
20130093080
2013-04-18

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #210
20130062765
2013-03-14

Low loop wire bonding

 #211
20130056448
2013-03-07

WIRE BONDING SYSTEM FOR SEMICONDUCTOR PACKAGE

 #212
20130049231
2013-02-28

Semiconductor chip with bonding wire and method for making the same

 #213
20130040426
2013-02-14

Manufacturing method using multi-step adhesive curing for sealed semiconductor device

 #214
20130005086
2013-01-03

Method of manufacturing semiconductor device

 #215
20120302009
2012-11-29

Method of manufacturing semiconductor device

 #216
20120288997
2012-11-15

Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)

 #217
20120288684
2012-11-15

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

 #218
20120286427
2012-11-15

Semiconductor device and a manufacturing method thereof

 #219
20120286304
2012-11-15

Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods

 #220
20120286023
2012-11-15

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

 #221
20120276693
2012-11-01

Module comprising a semiconductor chip

 #222
20120273826
2012-11-01

LED PACKAGE AND METHOD FOR MANUFACTURING SAME

 #223
20120267772
2012-10-25

Semiconductor device and method of manufacturing the same

 #224
20120256314
2012-10-11

Short and low loop wire bonding

 #225
20120241964
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #226
20120241931
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #227
20120238056
2012-09-20

Manufacturing method of semiconductor device

 #228
20120235308
2012-09-20

Manufacturing method of semiconductor device, and semiconductor device

 #229
20120228781
2012-09-13

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

 #230
20120211855
2012-08-23

Semiconductor apparatus, manufacturing apparatus, and manufacturing method

 #231
20120193791
2012-08-02

Semiconductor device and method of manufacturing the semiconductor device

 #232
20120193784
2012-08-02

METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #233
20120184068
2012-07-19

Method of manufacturing semiconductor device

 #234
20120175665
2012-07-12

Light-emitting device package and method of manufacturing the same

 #235
20120168946
2012-07-05

Semiconductor device and production method therefor

 #236
20120164795
2012-06-28

Ultrasonic wire bonding method for a semiconductor device

 #237
20120160902
2012-06-28

WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME

 #238
20120153464
2012-06-21

Localized alloying for improved bond reliability

 #239
20120146228
2012-06-14

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

 #240
20120139129
2012-06-07

Wire bonding method and semiconductor device

 #241
20120138662
2012-06-07

WIRE BONDING METHOD

 #242
20120132695
2012-05-31

WIRE FEEDING APPARATUS FOR WIRE BONDERS

 #243
20120125977
2012-05-24

Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers

 #244
20120118610
2012-05-17

BONDING WIRE FOR SEMICONDUCTOR

 #245
20120111923
2012-05-10

Wire bonding apparatus and method using the same

 #246
20120104613
2012-05-03

Bonding wire for semiconductor device

 #247
20120080527
2012-04-05

Transferring an antenna to an RFID inlay substrate

 #248
20120074206
2012-03-29

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

 #249
20120067940
2012-03-22

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS AND METHODS OF MAKING SAME

 #250
20120061826
2012-03-15

Semiconductor device

 #251
20120055976
2012-03-08

Method of manufacturing semiconductor device and wire bonding apparatus

 #252
20120052628
2012-03-01

Method of manufacturing semiconductor device

 #253
20120043670
2012-02-23

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

 #254
20120043650
2012-02-23

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

 #255
20120037687
2012-02-16

Capillary and ultrasonic transducer for ultrasonic bonding

 #256
20120032354
2012-02-09

WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS

 #257
20120032329
2012-02-09

Semiconductor integrated circuit device

 #258
20120031955
2012-02-09

Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds

 #259
20120031877
2012-02-09

Gas delivery system for reducing oxidation in wire bonding operations

 #260
20120024089
2012-02-02

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

 #261
20120018859
2012-01-26

Semiconductor device and method of manufacturing the same

 #262
20120018491
2012-01-26

Ultrasonic horn

 #263
20120018490
2012-01-26

Ultrasonic horn

 #264
20120018489
2012-01-26

Ultrasonic horn

 #265
20120013016
2012-01-19

Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same

 #266
20120006882
2012-01-12

Conductive bumps, wire loops, and methods of forming the same

 #267
20110315743
2011-12-29

Method of manufacturing semiconductor device, and bonding apparatus

 #268
20110309502
2011-12-22

Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device

 #269
20110304046
2011-12-15

Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer

 #270
20110303341
2011-12-15

Method for the miniaturizable contacting of insulated wires

 #271
20110278349
2011-11-17

Wire bonding apparatus and wire bonding method

 #272
20110272449
2011-11-10

Dual capillary IC wirebonding

 #273
20110269268
2011-11-03

Semiconductor device and a manufacturing method of the same

 #274
20110267790
2011-11-03

Semiconductor device and manufacturing method thereof

 #275
20110266700
2011-11-03

Wire bond interconnection and method of manufacture thereof

 #276
20110259941
2011-10-27

APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING

 #277
20110247197
2011-10-13

FORMING CHANNELS FOR AN ANTENNA WIRE OF A TRANSPONDER

 #278
20110241026
2011-10-06

LIGHT-EMITTING DIODE CHIP AND PACKAGE STRUCTURE THEREOF

 #279
20110226838
2011-09-22

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

 #280
20110223719
2011-09-15

Semiconductor device and manufacturing method of the same

 #281
20110199613
2011-08-18

Method for manufacturing optical device, optical device, and biological information detector

 #282
20110194273
2011-08-11

Light emitting device, method for manufacturing the same, and backlight unit

 #283
20110192885
2011-08-11

WIREBONDING PROCESS

 #284
20110192027
2011-08-11

Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof

 #285
20110186901
2011-08-04

LED package

 #286
20110186220
2011-08-04

Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same

 #287
20110180590
2011-07-28

Method of manufacturing semiconductor device and wire bonding apparatus

 #288
20110175223
2011-07-21

Stacked semiconductor components having conductive interconnects

 #289
20110175206
2011-07-21

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

 #290
20110171777
2011-07-14

Method of manufacturing semiconductor device

 #291
20110159644
2011-06-30

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

 #292
20110159641
2011-06-30

Method of manufacturing semiconductor device

 #293
20110155789
2011-06-30

Bonding apparatus

 #294
20110155423
2011-06-30

Circuit board and its wire bonding structure

 #295
20110151622
2011-06-23

Method of manufacturing semiconductor device

 #296
20110146408
2011-06-23

Method and apparatus for pass/fail determination of bonding and bonding apparatus

 #297
20110136334
2011-06-09

Method of forming at least one bonding structure

 #298
20110133319
2011-06-09

Auxiliary leadframe member for stabilizing the bond wire process

 #299
20110128369
2011-06-02

Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method

 #300
20110121053
2011-05-26

Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE