H01L2224/785 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Cooling means

• H01L2224/78501 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
• H01L2224/78502 » in the upper part of the bonding apparatus, e.g. in the capillary or wedge 2