H01L2224/786 - CPC Classification Index

ClassID:

210588 ⎘

H01L2224/786 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Means for supplying the connector to be connected in the bonding apparatus

Sub-classes:

H01L2224/78601 » Storing means 3
H01L2224/78611 » Feeding means 36
H01L2224/78621 » Holding means, e.g. wire clampers 48

Recent Application in this class:

20220208721

2022-06-30

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

20220204409

2022-06-30

Ceramic material and wire bonding capillary

20190279957

2019-09-12

Wire clamp apparatus calibration method and wire bonding apparatus

20160225738

2016-08-04

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

20160169355

2016-06-16

Drive mechanism and manufacturing device

20160049382

2016-02-18

Method of manufacturing a semiconductor package and wire bonding apparatus for performing the same

20140225247

2014-08-14

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

20110278349

2011-11-17

Wire bonding apparatus and wire bonding method

20110101073

2011-05-05

Automatic wire feeding method for wire bonders

#10

20100206849

2010-08-19

Wire bonding apparatus, record medium storing bonding control program, and bonding method

#11

20100181367

2010-07-22

Wire bonding apparatus and wire bonding method

#12

20100133322

2010-06-03

Wire bonding apparatus, record medium storing bonding control program , and bonding method

#13

20100067123

2010-03-18

Imaging device for a bonding apparatus

#14

20090200357

2009-08-13

Wire clamp and wire bonding apparatus having the same

#15

20090124028

2009-05-14

Imaging device and method for a bonding apparatus

#16

20090072063

2009-03-19

Spool wound with a gold alloy wire used for a bonding process

#17

20090059361

2009-03-05

Imaging device and method for a bonding apparatus

#18

20090053911

2009-02-26

Printed board with component mounting pin

#19

20090053910

2009-02-26

Printed board with component mounting pin

#20

20080197168

2008-08-21

Wire cleaning guide

#21

20080099532

2008-05-01

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

#22

20080054440

2008-03-06

Wire bonding method, wire bonding apparatus and semiconductor device

#23

20080023028

2008-01-31

Bonding apparatus and method for cleaning tip of a bonding tool

#24

20070287222

2007-12-13

Method of fixing curved circuit board and wire bonding apparatus

#25

20070212821

2007-09-13

Method for manufacturing semiconductor device

#26

20070199974

2007-08-30

Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine

#27

20070190819

2007-08-16

Printed board with a pin for mounting a component

#28

20070187470

2007-08-16

Wire bonding apparatus, record medium storing bonding control program, and bonding method

#29

20070187138

2007-08-16

Wire bonding apparatus, record medium storing bonding control program, and bonding method

#30

20070181651

2007-08-09

Method for setting capillary contact position data and wire bonding apparatus using the same

#31

20070023487

2007-02-01

Wire bonding method and device of performing the same

#32

20070000878

2007-01-04

Bonding apparatus and method

#33

20060118597

2006-06-08

Roller wire brake for wire bonding machine

#34

20060065695

2006-03-30

Wire feed system for a wire bonding apparatus

#35

20060049233

2006-03-09

Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication

#36

20050176178

2005-08-11

Method for manufacturing semiconductor device

#37

20050139637

2005-06-30

Wire bonder for ball bonding insulated wire and method of using same

#38

20050133563

2005-06-23

Wire bonding apparatus and method for clamping a wire

#39

20050127137

2005-06-16

Roller wire brake for wire bonding machine

#40

20050109814

2005-05-26

Bonding tool with resistance

#41

20050087585

2005-04-28

Automated filament attachment system for vacuum fluorescent display