H01L2224/78981 - CPC Classification Index

ClassID:

210636 ⎘

H01L2224/78981 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors Apparatus chuck

Sub-classes:

H01L2224/78982 » Shape 0
H01L2224/78985 » Material 0
H01L2224/78986 » Auxiliary members on the pressing surface 1

Recent Application in this class:

20240194634

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

20200238433

Bonding process with rotating bonding stage

20180326531

Bonding apparatus with rotating bonding stage

20180272463

Ultrasonic vibration bonding apparatus

20170309503

Mounting apparatus

20140217152

Lead frame support plate and window clamp for wire bonding machines

20140014708

Lead frame support plate and window clamp for wire bonding machines