210778 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Pre-treatment of the bonding area Reshaping the bonding area in the bonding apparatus, e.g. flattening the bonding area
Sub-classes:PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
#2BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
#3Low temperature hybrid bonding
#4Edge-trimming methods for wafer bonding and dicing
#5Edge-trimming methods for wafer bonding and dicing
#6Wafer bonding method
#7Method for bonding substrates together, and substrate bonding device
#8Method for manufacturing a multilayer structure on a substrate