210786 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Pre-treatment of the bonding area Forming additional members
METHODS AND STRUCTURE FOR HYBRID BONDING
#2BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
#3Low temperature hybrid bonding
#4Integrated structure with bifunctional routing and assembly comprising such a structure
#5Bond pad with micro-protrusions for direct metallic bonding
#6Probe methodology for ultrafine pitch interconnects
#7Probe methodology for ultrafine pitch interconnects
#8SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
#9Conductive pillar shaped for solder confinement
#10Method for bonding substrates
#11Semiconductor structure and method of manufacturing thereof