210790 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding environment; Composition of the atmosphere being oxidating
Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device
#2Direct bonding method
#3Process for producing a structure by assembling at least two elements by direct adhesive bonding
#4Integrated Alignment and Bonding System