210826 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding Arrangement of the bonding areas prior to mounting
Sub-classes:DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH DEVICE
#2CONDUCTIVE BARRIER DIRECT HYBRID BONDING
#3SEMICONDUCTOR DEVICE WITH VOLUMETRICALLY-EXPANDED SIDE-CONNECTED INTERCONNECTS
#4Device including semiconductor chips and method for producing such device
#5Conductive barrier direct hybrid bonding
#6Device including semiconductor chips and method for producing such device
#7Conductive barrier direct hybrid bonding
#8Device including semiconductor chips and method for producing such device
#9Conductive barrier direct hybrid bonding
#10Chip-on-wafer package and method of forming same
#11Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#12Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#13Conductive barrier direct hybrid bonding
#14Chip-on-wafer package and method of forming same
#15Semiconductor cooling method and method of heat dissipation
#16Semiconductor device and method of forming double-sided fan-out wafer level package
#17Semiconductor device and manufacturing method thereof
#18Device including semiconductor chips and method for producing such device
#19Method of liquid assisted micro cold binding