210837 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Applying energy for connecting using a reflow oven
Sub-classes:Method for producing joined structure
#2SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
#3Method for bonding substrates together, and substrate bonding device
#4Method for bonding substrates
#5Semiconductor package with through silicon vias and method for making the same
#6Hermetic wafer-to-wafer bonding with electrical interconnection
#7HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION