210839 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Applying energy for connecting with energy being in the form of electromagnetic radiation
Sub-classes:BONDING LAYER AND PROCESS
#2Bonding system and bonding method
#3BONDING SYSTEM AND BONDING METHOD
#4Substrate bonding apparatus and method of manufacturing a semiconductor device
#5BONDING SYSTEM AND BONDING METHOD
#6Semiconductor-on-insulator with back side heat dissipation
#7Semiconductor-on-insulator with back side strain topology
#8Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#9Semiconductor-on-insulator with back side strain inducing material
#10Semiconductor-on-insulator with back side heat dissipation