210848 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding Bonding interfaces of the bonding area
Sub-classes:Structure of semiconductor device
#2Semiconductor device and manufacturing method thereof
#3Micro LED display and manufacturing method therefor
#4Structure of semiconductor device and method for bonding two substrates
#5Bond pads for low temperature hybrid bonding
#6Interface structures and methods for forming same
#7Bond pads for low temperature hybrid bonding
#8Interface structures and methods for forming same
#9Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#10Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
#11Bonding structure for stacked semiconductor devices
#12Hybrid bonding mechanisms for semiconductor wafers
#13Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers
#14Bonding surfaces for direct bonding of semiconductor structures
#15Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#16Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#17Pad bonding employing a self-aligned plated liner for adhesion enhancement
#18Solid-state imaging element, method for manufacturing solid-state imaging element, and electronic device
#19Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
#20Solid-state image pickup apparatus and image pickup system
#21Pad bonding employing a self-aligned plated liner for adhesion enhancement
#22Room temperature metal direct bonding
#23Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same
#24Bonding of substrates including metal-dielectric patterns with metal raised above dielectric
#25Method for bonding wafers to produce stacked integrated circuits
#26Method for bonding wafers to produce stacked integrated circuits
#27Room temperature metal direct bonding
#28Room temperature metal direct bonding