210855 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Bonding interfaces of the semiconductor or solid state body having an external coating, e.g. protective bond-through coating
SEMICONDUCTOR PACKAGE
#2MULTI-METAL CONTACT STRUCTURE
#3SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
#4Multi-metal contact structure
#5Multi-metal contact structure in microelectronic component