210857 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding Bonding interfaces outside the semiconductor or solid-state body
Sub-classes:SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#2Manufacturing method of semiconductor device
#3Semiconductor structure and manufacturing method thereof
#4Semiconductor structure and manufacturing method thereof
#5Semiconductor device and method of manufacturing the same