210909 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding with the bonding area not providing any mechanical bonding; Pressing a bonding area against another bonding area by means of a further bonding area or connector by means of a bump or layer connector
Scalable package architecture and associated techniques and configurations
#2Scalable package architecture and associated techniques and configurations
#3Scalable package architecture and associated techniques and configurations
#4Methods of manufacturing a semiconductor device
#5Component built-in board and method of manufacturing the same, and component built-in board mounting body
#6Chip package and a method for manufacturing a chip package
#7Method for assembling a chip in a flexible substrate