210920 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding; Post-treatment of the bonding area; Cleaning, e.g. oxide removal step, desmearing Thermal cleaning, e.g. using laser ablation or by electrostatic corona discharge