ClassID:

210960

H01L2224/81052 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Detaching bump connectors, e.g. after testing

Recent Application in this class:
#1
20240213212
2024-06-27

REVERSABLE ATTACHMENT SYSTEM

#2
20210280546
2021-09-09

Stacked semiconductor device and multiple chips used therein

#3
20180240719
2018-08-23

Removable sacrificial connections for semiconductor devices

#4
20170374743
2017-12-28

Mounting structure and method for manufacturing same

#5
20170256467
2017-09-07

Removable sacrificial connections for semiconductor devices

#6
20150116970
2015-04-30

Mounting structure and method for manufacturing same

#7
20100297814
2010-11-25

Electronic system modules and method of fabrication

#8
20100007012
2010-01-14

Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well

#9
20090085203
2009-04-02

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

#10
20090057896
2009-03-05

Nail-shaped pillar for wafer-level chip-scale packaging

#11
20090014873
2009-01-15

Electronic device and manufacturing method

#12
20090004760
2009-01-01

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

#13
20080308930
2008-12-18

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

#14
20080079140
2008-04-03

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

#15
20080026557
2008-01-31

Electronic system modules and method of fabrication

#16
20070245554
2007-10-25

Fabrication method for electronic system modules

#17
20070152347
2007-07-05

Face down type semiconductor device and manufacturing process of face down type semiconductor device

#18
20070148950
2007-06-28

Object and bonding method thereof

#19
20070102803
2007-05-10

Method for making stacked integrated circuits (ICs) using prepackaged parts

#20
20070053310
2007-03-08

Manufacturing method of electronic device

#21
20060144515
2006-07-06

Method for releasing adhered article

#22
20060131728
2006-06-22

Repairable three-dimensional semiconductor subsystem

#23
20060081583
2006-04-20

Method and process of contact to a heat softened solder ball array

#24
20050282411
2005-12-22

Stud bump socket

#25
20050224971
2005-10-13

Circuit board, device mounting structure, device mounting method, and electronic apparatus