H01L2224/81053 - CPC Classification Index

ClassID:

210961 ⎘

H01L2224/81053 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector Bonding environment

Sub-classes:

H01L2224/81054 » Composition of the atmosphere 77
H01L2224/81085 » being a liquid, e.g. for fluidic self-assembly 11
H01L2224/8109 » Vacuum 42
H01L2224/81091 » Under pressure 14
H01L2224/81095 » Temperature settings 13