H01L2224/81122 - CPC Classification Index

ClassID:

210981 ⎘

H01L2224/81122 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Aligning; Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body

Sub-classes:

H01L2224/81123 » Shape or position of the body 7
H01L2224/81125 » Bonding areas on the body 28
H01L2224/81127 » Bonding areas outside the body 9
H01L2224/81129 » Shape or position of the other item 8

Recent Application in this class:

20210183716

Semiconductor device with a protection mechanism and associated systems, devices, and methods

20200168517

Semiconductor device with a protection mechanism and associated systems, devices, and methods

20190019747

Input/output cell wire connector

20180026012

Multilayer substrate

20170365497

METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PARTICULARLY SUITED FOR POSITIONING ELECTRONIC CHIPS USING INTERPOSERS

20170358549

Multilayer substrate

20170162613

Photodetector-arrays and methods of fabrication thereof

20160351528

Mounting apparatus and method of correcting offset amount of the same

20160133485

SYSTEMS AND METHODS FOR IN-LINE MEASUREMENT OF PRE-UNDERFILL WETTING ANGLE

20150333033

Pick-and-place tool for packaging process

20110281375

Magnetic microelectronic device attachment

20100308471

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

20080265367

Magnetically alignable integrated circuit device

20050199995

Semiconductor element and wafer level chip size package therefor