210998 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head
Sub-classes:Window assemblies, imaging system including the same, method of manufacturing the imaging system, and electronic apparatus including the imaging system
#2Thermocompression bond tips and related apparatus and methods
#3Thermocompression bond tips and related apparatus and methods
#4Circuit pin positioning structure, fabrication method of soldered circuit elements, and method of forming circuit pins of a stacked package
#5Pick-and-place tool for packaging process
#6Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging
#7Methods and systems involving soldering