211012 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector; Applying energy for connecting; Compression bonding; Ultrasonic bonding Thermosonic bonding
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR
#2BONDING SYSTEMS FOR BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED METHODS
#3BONDING APPARATUS AND BONDING METHOD USING THE SAME
#4Interconnect structure for semiconductor with ultra-fine pitch and forming method thereof
#5CHIP MODULE WITH HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF
#6Ultrasonic-assisted solder transfer
#7Method for manufacturing display device
#8SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#9Microelectronic packages with high integration microelectronic dice stack
#10Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor device
#11Semiconductor substrate with integrated inductive component
#12Microelectronic packages with high integration microelectronic dice stack
#133-D STACKING SEMICONDUCTOR ASSEMBLY HAVING HEAT DISSIPATION CHARACTERISTICS
#14Electronic substrates having embedded dielectric magnetic material to form inductors
#15Vibration device, electronic apparatus, and vehicle
#16Microelectronic packages with high integration microelectronic dice stack
#17SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#18Semiconductor die with back-side integrated inductive component
#19Mounting Method of a semiconductor device using a colored auxiliary joining agent
#20Systems and methods for bonding semiconductor elements
#21Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate
#22Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
#23Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
#24Systems and methods for bonding semiconductor elements
#25Semiconductor device and corresponding method
#26Electronic device and method for producing an electronic device
#27Thermally enhanced semiconductor assembly with three dimensional integration and method of making the same
#28Systems and methods for bonding semiconductor elements
#29Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener
#30Organic thin film passivation of metal interconnections
#31SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#32THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#33Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same
#34Semiconductor assembly with electromagnetic shielding and thermally enhanced characteristics and method of making the same
#35Thermally enhanced face-to-face semiconductor assembly with built-in heat spreader and method of making the same
#36STACKED SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED INTERCONNECT BANDWIDTH
#37Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
#38Semiconductor device mounting method
#39Methods to form high density through-mold interconnections
#40Systems and methods for bonding semiconductor elements
#41Substrate for mounting chip and chip package
#42Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#43Organic thin film passivation of metal interconnections
#44Thin plastic leadless package with exposed metal die paddle
#45Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
#46Systems and methods for bonding semiconductor elements
#47Surface mounted piezoelectric vibrator
#48System and method for manufacturing a fabricated carrier
#49Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#50Semiconductor assembly and method of manufacturing the same
#51Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#52Integrated circuit package including in-situ formed cavity
#53Electronic component and method of fabricating the same
#54Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#55Organic thin film passivation of metal interconnections
#56Microelectronic assembly with thermally and electrically conductive underfill
#57Methods of fabricating electronics assemblies
#58Interconnect structures and methods of making the same
#59Semiconductor device and method of manufacturing the same
#60Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#61ROOM TEMPERATURE DIRECT METAL-METAL BONDING
#62In-situ cavity integrated circuit package
#63Method of bonding
#64Thin plastic leadless package with exposed metal die paddle
#65Semiconductor device
#66Semiconductor device
#67Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#68Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
#69Package assembly for electronic device